グローバルなメーカーとサプライヤーが信頼できる取引プラットフォームを構築する。
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Contact Finish - Mating :
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27434 プロダクト
モデル 価格 数量 株式 メーカー 説明 Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
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Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
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Samtec Inc. CONN SOCKET PLCC 32POS TIN PLCC Obsolete   -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin   Tin 32 (2 x 7, 2 x 9) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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$188.6880
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3M BGA 1MM 25 25MM 23 MATRIX 168PIN   Active                                
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$154.1100
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3M BGA SOCKET 1MM 676 POS 26X26   Active           BGA                    
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$91.6360
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3M 10X10 GRID ZIP SOCKET   Active   -55°C ~ 150°C Through Hole Solder Closed Frame   Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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$57.8180
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3M BGA 1.00MM 9X9 8X8 64 PIN   Active                                
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$34.4000
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TE Connectivity AMP Connectors CONN SOCKET LGA 2011POS GOLD   Active     Surface Mount Solder Open Frame LGA Thermoplastic   Gold 30.0µin (0.76µm) Gold 2011 (47 x 58) Copper Alloy   30.0µin (0.76µm) Copper Alloy
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$16.1600
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TE Connectivity AMP Connectors DUAL LGA,257 POS, DMD SOCKET DMD Active   -25°C ~ 100°C Surface Mount Solder Board Guide, Open Frame LGA Thermoplastic 0.039" (1.00mm) Gold 3.00µin (0.076µm)   257 (20 x 30) Copper Alloy      
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$14.2600
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TE Connectivity AMP Connectors CONN SOCKET LGA 1151POS GOLD   Active     Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 1151 Copper Alloy 0.036" (0.91mm) 15.0µin (0.38µm) Copper Alloy
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$6.4400
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder   SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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$6.1600
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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$5.2400
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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$4.3900
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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$2.4500
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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$2.4300
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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$2.0900
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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$1.6600
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
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$1.5400
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
D01-9933246
ユニット
$7.3000
見積もりを取得
RFQ
100
在庫あり
Harwin Inc. CONN SOCKET SIP 32POS TIN D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass 0.100" (2.54mm)   Brass
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見積もりを取得
RFQ
450
在庫あり
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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ユニット
$2.7500
見積もりを取得
RFQ
450
在庫あり
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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ユニット
$1.8981
見積もりを取得
RFQ
450
在庫あり
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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見積もりを取得
RFQ
700
在庫あり
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
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ユニット
$2.1600
見積もりを取得
RFQ
700
在庫あり
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
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ユニット
$1.2723
見積もりを取得
RFQ
700
在庫あり
Samtec Inc. CONN IC DIP SOCKET 16POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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見積もりを取得
RFQ
450
在庫あり
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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ユニット
$1.4100
見積もりを取得
RFQ
450
在庫あり
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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ユニット
$0.9520
見積もりを取得
RFQ
450
在庫あり
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
Default Photo
見積もりを取得
RFQ
275
在庫あり
Samtec Inc. CONN IC DIP SOCKET 32POS TIN Active                                
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